fkie_cve-2017-18313
Vulnerability from fkie_nvd
Published
2018-10-23 13:29
Modified
2024-11-21 03:19
Severity ?
5.3 (Medium) - CVSS:3.0/AV:A/AC:H/PR:N/UI:N/S:U/C:N/I:H/A:N
Summary
Under certain mode of operations, HLOS may be able get direct or indirect access through DXE channels to tamper with the authenticated WCNSS firmware stored in DDR because DXE-accessible memory is located within the authenticated image in Snapdragon Mobile and Snapdragon Wear in version MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 615/16/SD 415, SD 617.
References
product-security@qualcomm.comhttps://source.android.com/security/bulletin/2018-09-01#qualcomm-closed-source-componentsThird Party Advisory
product-security@qualcomm.comhttps://www.qualcomm.com/company/product-security/bulletinsVendor Advisory
af854a3a-2127-422b-91ae-364da2661108https://source.android.com/security/bulletin/2018-09-01#qualcomm-closed-source-componentsThird Party Advisory
af854a3a-2127-422b-91ae-364da2661108https://www.qualcomm.com/company/product-security/bulletinsVendor Advisory
Impacted products
Vendor Product Version
qualcomm msm8909w_firmware -
qualcomm msm8909w -
qualcomm sd_210_firmware -
qualcomm sd_210 -
qualcomm sd_212_firmware -
qualcomm sd_212 -
qualcomm sd_205_firmware -
qualcomm sd_205 -
qualcomm sd_410_firmware -
qualcomm sd_410 -
qualcomm sd_412_firmware -
qualcomm sd_412 -
qualcomm sd_615_firmware -
qualcomm sd_615 -
qualcomm sd_616_firmware -
qualcomm sd_616 -
qualcomm sd_415_firmware -
qualcomm sd_415 -
qualcomm sd_617_firmware -
qualcomm sd_617 -


To clipboard 

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  "id": "CVE-2017-18313",
  "lastModified": "2024-11-21T03:19:50.010",
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